MS Level Training in Korean Universities/Industry
10 years program starting from 2006 upto 2015 induction in each academic year.
Detail are as under:-
INTRODUCTION:
The Scheme envisages Master level training of Pakistani candidates in advanced Engineering and Technological fields at South Korean Universities.
Maximum 24 months scholarship funded By HEC, for MS (Engineering) studies, starting from Fall/September-2008 session, in leading Korean Universities. Selected Applicants will have to secure admission in HEC identified universities, on their own.
Industry training opportunity (Maximum 6 months), may be arranged in Leading Korean Industries, depending upon the arrangements by the host university.
OBJECTIVES:
The Scheme envisages Master level training of Pakistani candidates in advanced Engineering and Technological fields at South Korean Universities.
The objectives of the scheme are:
i) To create a critical mass of highly qualified Engineering Manpower in high-tech fields.
ii) To build up the capacity of Universities/Industries in Pakistan, by training manpower in priority Engineering and Technological fields.
iii) To facilitate assimilation, absorption and transfer of important and promising technologies to get high-tech products and achieve rapid economic progress.
iv) To provide opportunities to young talented Engineers for training/research work at Industries / advanced research labs and reputed universities abroad and interaction with foreign engineers working at frontiers of knowledge.
v) To encourage international cooperation in Engineering and Technology through harnessing training opportunities offered by South Korea.
ELIGIBILITY CRITERIA:
All Pakistani/AJK National.
Born on or after 31-10-1972.
Having completed minimum of 16 years of academic education (i.e. 10 years SSC, 2 years HSSC, 4 years Engineering Degree)
Have obtained at least (exact, without rounding off) 3.0/4.0 CGPA (in case of CGPA System) or 60 % marks (in case of Percentage Marks System) in the BE/B.Sc (Engineering) in Degree Exam (whichever is applicable) BE/BSc. (Engg) degree and transcript have to be attested by A&A division HEC, with out which application form will NOT be accepted, details can be obtained from:
http://www.hec.gov.pk/new/QualityAss...n_Services.htm
Engineering Program & Degree year (in which you have studied) must be accredited by Pakistan Engineering Council (PEC)
http://www.pec.org.pk/first_schedule.htm
Must have secured 50 or above marks in any NTS-HEC scholarship Test or any GAT test held on 12th November, 2006, 7th January, 2007, 8th April, 2007, 8th July, 2007 and 7th October, 2007.
NO D Grade in entire academic career.
NO less than 50% marks in entire academic career.
Should NOT currently availing any other (HEC/Govt.) scholarship.
Terms and Conditions for the Award of scholarship for Ms level Training in Korean Universities/Industry
I, Mr/Ms/Mrs.______________________________________________ __, I.D card No. _____________________, Son /Daughter of Mr._________________________________________, do hereby unconditionally accept the offer of HEC scholarship, awarded under the scholarship project titled: MS Level Training in Korean Universities / Industry, under the following terms and conditions, communicated by HEC vide letter no. F.No, dated:
Award of Scholarship:
The final selection of candidates would be made on merit by the National Scholarship Management Committee (NSMC). The selected candidates would be required to execute a bond with the HEC. The terms and conditions of the bond are available on the website.
Terms and Conditions Governing the Scholarship
The terms & conditions of the award of scholarship are described in various legal documents, given below. Acceptance of scholarship under these terms and condition entail an acknowledgement of following obligations:
Obligations for An Awardee
i. An awardee will not change the course of study specified in the letter of award without obtaining prior approval of the Project Director (South Korean Project), Higher Education Commission.
ii. An awardee is not to hold any other scholarship/stipend during the scholarship period of his/her study.
iii. A change of university/institute during the study will only be admissible with the written and prior approval of the Project Director (South Korean Project), Higher Education Commission.
iv. An awardee, who is Govt./Semi-Govt./Autonomous organizations employee, would obtain leave from his employer to join the institution of his study, on full-time basis.
v. An awardee is required to execute a bond with the HEC ensuring to serve pubic sector universities/ R&D organizations in Pakistan, for 2 years, after completion of his/her Masters Program.
vi. An awardee shall sign an agreement with the authorize representative of Higher Education Commission (HEC), on judicial stamp paper, to the effect that in case the awardee fails to complete his/her study, he/she will refund to the HEC, the total amount spent on his/her studies by the HEC. The format of the agreement is enclosed as a specimen.
vii. In addition, a personal guarantee of a person of means, on judicial stamp paper, to the effect of ensuring the recovery in case of default would need to be furnished. Specimen is attached.
viii. Every document i.e. Deed of Agreement, Guarantee to HEC and Certification of Financial Soundness must be properly notarized, that means the document must be registered by the Notary Public maintained by him as Notary register and the signatures of the executant must be obtained on the register and the number of the registration must be mentioned along with the notary public stamp.
ix. An awardee shall verify that while availing HEC scholarship titled: MS Level training in Korean Universities/ Industry, he/she will not apply for any scholarship from any source and will not avail scholarship from any other source, without seeking written and prior permission from the concerned Project Director (South Korean Project HEC). Violation of this will be liable for any appropriate action by HEC.
Name:_____________________________________________ _________________________
Signature: ________________________________, Date: _____________________________
Attested by a first class/Gazetted Govt. officer
Name:____________________________________, Official Stamp:__________________________
Annex-A
(To be executed on Rs. 50/- judicial stamp paper)
DEED OF AGREEMENT
FOR UNDERTAKING A COURSE OF STUDIES
HEC scholarship under project titled: MS Level Training in Korean Universities/ Industry
This agreement is made, on the
..day of
.2008, between
(1) Mr. / Ms.
son / daughter
of
....hereby called the Scholar, and
(2) Higher Education Commission through the authorized officer in the HEC,
hereinafter called the HEC.
WHEREAS Mr. / Ms.
has been selected by the Higher Education Commission for the award of Scholarship for Master studies under the Scheme Ms Level Training in Korean Universities/ Industry and the scholar has agreed to accept the same on the terms and conditions governing this scholarship award.
Now this deed witnesses as under:
i) This scholarship award shall be initially valid for one year and may be renewed up to a maximum total duration of 24 months, towards Master degree, subject to satisfactory academic performance of the scholar.
ii) The payment of allowances admissible under the scholarship program shall be made subject to the complete adherence to all rules and regulations governing the scholarship program as well as satisfactory performance in the authorized studies.
iii) The scholar shall not change the specified course of studies nor register himself/herself for any other course or program without prior approval of the HEC.
iv) The scholar shall not extend the specified period of studies without prior approval of the HEC.
v) During two years of Masters Program the scholar shall not undertake employment whether paid or otherwise without approval of the HEC. After completion of MS program, the six months training, at Korean industries is not the subject of this clause.
vi) The scholar shall refrain from engaging himself/herself in any political, commercial or any other activity incompatible with his/her program of studies abroad.
vii) In case the scholar fails to qualify the course for which he/she was awarded Scholarship, the HEC reserves the right to recover entire expenditure inclusive of travel cost from the Scholars/Guarantor.
viii) The scholar shall return to Pakistan, immediately after the completion of Masters program (in approved field) and on-the-job training in one of leading Korean Industry. The scholars will serve pubic sector universities/ R&D organizations in Pakistan, for 2 years.
ix) The Scholar shall contact HEC immediately after his/her return to Pakistan and would inform about his/her employment/posting with date of joining.
x) If an awardee, after completion of Masters program, gets a Ph.D scholarship from sources other than HEC, he may do so, getting approval from HEC, subject to the undertaking, given by him in writing and on HEC prescribed format, that after completion of Doctorate program, he/she will return to Pakistan and serve any university/R&D organization form 2 years.
xi) The scholar shall not incur any debts during his/her stay abroad and will clear all outstanding bills before leaving the country of study/training/research.
xii) The scholar shall regularly submit the quarterly / six monthly progress reports on his/her assigned Program, through the academic supervisor abroad to the Higher Education Commission and a final comprehensive report, immediately on completion of the study/training/research.
xiii) The scholar can not apply for any other Scholarship without seeking written and prior permission of Project Director (South Korean Project, HEC), for which the awardee has to send written application and then obtain a written approval from concerned Project Director.
xiv) The scholar can not avail any other Scholarship without seeking written and prior approval of Project Director (South Korean Project, HEC).Violation of this will be liable for any appropriate action by HEC.
xv) The scholar will be liable to disciplinary action as follows:
a) If he/she fails to avail of the award without any cogent reason acceptable to HEC/Government of Pakistan, he/she will be debarred from further study/training/research abroad under any Scholarship Program run by HEC. If any financial loss is sustained as a result of his/her failing thus to avail the award, he/she will be held responsible therefore and liable to make good the same, apart from being liable to any penalty to be imposed by the Commission in this behalf.
b) If he/she fails to comply with the instructions/orders of HEC for proceeding abroad without any cogent reason acceptable to HEC, he/she will be liable to reimburse the Commission, on demand, the amount of passage money spent either by the country to be visited or HEC or both, in connection with his/her scheduled visit abroad.
c) If he/she fails to obey or act in accordance with HECs order directing him/her to return to Pakistan, he/she will be liable to action under the acts/rules in force in Pakistan impounding or confiscating passports.
d) If he/she violates any condition laid down in the Bond for studies/training abroad under the Scholarships Program, he/she will be liable to pay the penalty as prescribed therein.
xvi) The scholar is liable to disqualification from HEC sponsored foreign training or such other disciplinary action as HEC may consider appropriate, if:
i) He / she violates any of the foregoing conditions, in his application form or final documents(discovered at a later stage) or
ii) He / she is found to have made any misstatement therein before.
AND THE SCHOLAR FURTHER COVENANTS, that in case of breach of any of the above terms and conditions as well as the rules / terms and conditions those governing scholarship award and / or his / her failure to return to and serve in Pakistan as directed by the HEC for the specified period, the scholar shall be bound to pay the HEC a penalty as prescribed by the HEC besides compensate the HEC by making a refund of the total amount of expenditure including travel cost incurred on him / her in Pakistan Rupees and in foreign currency or its equivalent in Pakistan Rupees at the official rate of exchange prevalent on the date of the breach of the above agreement. The amount of penalty and the compensation as prescribed and assessed by the HEC shall be final and conclusive.
IN WITNESS WHEROF, the parties aforementioned have signed this deed in token of acceptance thereof.
Dealing Officer of HEC Scholar / Awardee
(Authorized Officer)
Signature:
.
Signature of Candidate
STAMP: Full Name:
.
Designation:
...
N. I. Card No:
.
Present Phone No:
..
Address:
.
Dated:
.
Witness No.1 Witness No.2
Signature ______________________ Signature:____________________
a) Name a) Name: ____________________
b) Designation_________________ b) Designation________________
(Official Seal) (Official Seal)
c) Address c) Address___________________
______________________________ ____________________________
______________________________ ____________________________
Annex-B
(To be executed on Rs. 20/- judicial stamp paper)
GUARANTEE TO THE HIGHER EDUCATION COMMISSION
(Part of the Undertaking)
I,
..son/daughter (Surety/Guarantor)
of
do hereby guarantee the payment of any such sum as penalty and compensation as prescribed and assessed by the Higher Education Commission which the above scholar may be called upon to pay to HEC for the breach of any of the terms and conditions of the above agreement as well as those governing Ms Level Training in Korean Universities/ Industry award and I hereby undertake to pay the total sum on demand in the event of the scholar making a default in the payment of the sum.
Signature:
(Surety/Guarantor)
Name:
..
N.I. Card No
Present Address:
.
Permanent Address:
WITNESS 1 WITNESS 2
Signature:
.. Signature:
..
Name:
. Name:
N.I.Card No
N.I. Card No
Address:
. Address:
(Attested by Judicial Magistrate)
STAMP Signature:
Name:
.
Address:
.
Annex-C
(To be executed on Rs. 20/- judicial stamp paper)
CERTIFICATION TO THE FINANCIAL SOUNDESS
OF
SURETY/GUARANTOR BY A GOVERNMENT OFFICER
Certified that I, Mr./ Ms
...
N.I. Card No
Resident of
and working in
..as
kno w Mr./Ms
..
(Surety/Guarantor)
Son/daughter of
Who has stood surety/guarantee to
..
Mr./Ms
..as Scholar in the field of (Ms Level Training in Korean Universities/ Industry)
and that Mr./Ms.
.
(Surety/Guarantor)
possesses financially sound position and is capable of paying a sum equal to the expenditure incurred by the Higher Education Commission, Pakistan on the studies of Mr./Ms
.
(Name of Scholar)
under the Ms Level Training in Korean Universities/ Industry in case of default by him/her.
Name:
.
Official Stamp Designation:
..
Present Address:
.
Permanent Address:
ANNEX-D
(To be executed on Rs. 30/- judicial stamp paper)
(Please attach attested photocopies of Immovable Property)
DECLARATION OF ASSETS IN RESPECT OF
(
)
(Guarantor/Surety/Scholar)
S. No. Name of Property Location/Address Approx. Value
Signature:
.
Name:
..
Address:
..
Verified by
Officer Stamp Signature:
Name:
..
(Class-I Gazetted Officer)
Counter Signed by Signature:
Official Stamp Name:
..
The value of property is authenticated and it is without any encumbrance.
Signature:
.
Name:
..
(Tehsildar/Notary Public)
Annex-E
(To be executed on Rs. 60/- judicial stamp paper)
SURETY BOND FOR UNDERTAKING STUDIES/TRAINING ABROAD
Know all men by these presents that we (1) Mr. ____________________ S/o ________________ of the permanent address __________________________________ (herein-after called the trainee) and (2) Mr. ___________________ S/o _______________________ of the permanent address ___________________________, (herein after called the surety) are held and firmly bound up to the president of Pakistan, (herein after called the President) through Higher Education Commission, for all moneys, charges, costs and expenses as may be determined by the President as having been incurred on or in respect of the trainees studies/training which amount will not question to be paid to the President, his successors in office or assigns for which payment well and truly to be made, we hereby bind ourselves, each of us, our and each of our heirs, executors administrators jointly and severally.
Signed and delivered this on ______________________.
Signature________________________________________
(Trainee)
Full Name _______________________________________
Address _________________________________________
Signature ________________________________________
(Surety)
Full Name _______________________________________
Address _________________________________________
WHEREAS on his/her request the President has selected the trainee for studies/training in Master under the Ms Level Training in Korean Universities/ Industry now the condition of above-written bond is that if the trainee shall successfully complete his studies/training, and shall return to Pakistan immediately after wards and serve within Pakistan for a minimum period of two years as may be directed by the Federal Government through the Higher Education Commission and not seek employment outside Pakistan without the prior approval of the Federal Government through Higher Education Commission when the above written bond shall be void and of no effect, otherwise it shall be and remain in full force and virtue.
Signed jointly by each of us this on ______ day of ________¬¬¬¬________, _______ in the presence of the following witnesses:
Witnesses
1. Signature _________________
Name __________________________ S/o ______________________
Address __________________________________________________ __
2. Signature _________________
Name __________________________ S/o ______________________
Address __________________________________________________ __
Presented for registration this Surety Bond by _________________________ S/o ________________________ permanent resident of ______________________________________ before me, at the office of Joint/Sub Registrar ______________, on this ______ day of ____________________, between the hours ______ to ____
Executant __________________ __________________________
Name: ___________________________ Name: ___________________________
NIC: ____________________________ NIC: ____________________________
Joint/Sub Registrar
Execution and completion of this deed has been admitted by the said Executant, who hereby undertake to abide by and subscribe to all the terms and conditions set forth in the body of this Surety Bond. The Executant is identified by M/S:
Witnesses:
1. ____________________
____________________________S/o _______________________R/o_____________________________
NIC: _________________________________
1. ____________________
____________________________S/o _______________________R/o_____________________________
NIC: _________________________________
The witnesses are relied upon.
Executant___________________
Joint/Sub Registrar
CERTIFICATE
Registered at No: __________ on this ___________day of __________ 2004 and its duplicate copy pasted in the additional Book No: ______ Volume No: ______ on Pages _______ to ______.
The Executant and the witnesses have set their hands in my presence.
Joint/Sub Registrar
HOW TO APPLY:
Application Procedure (Batch V), for Fall/ September 2008 Session
Application Form (*.doc format) is available here:
Download Application Form in Doc Format:
http://www.hec.gov.pk/new/HRD/Schola...Batch-%20V.doc
Download Application Form in PDF Format:-
http://www.hec.gov.pk/new/HRD/Schola...Batch-%20V.pdf
Download application form. Type, using capital letters. Use Extra sheets (typed in MS-Word) where necessary.
Attach attested copies of following documents with your application form:
1. SSC/O-level, HSSC/A-level certificates
2. BE/BSc. (Engg) degree and transcript have to be attested by A&A division HEC, with out which application form will NOT be accepted, details can be obtained from:
http://www.hec.gov.pk/new/QualityAss...n_Services.htm .
3. All transcripts/marks sheets from Matric to highest degree.
4. NTS HEC scholarship test score card, obtained on either of the test dates: 12th November, 2006, 7th January, 2007, 8th April, 2007, 8th July, 2007 and 7th October, 2007.
5. All payments are to be made to HEC through HBL online facility. This facility is available in all branches of Habib Bank Ltd. A separate bank Account No. 01120050011901 is being maintained for the purpose. A Proforma for depositing funds is available at the following URL
www.hec.gov.pk/payment. Deposit an amount of Rs. 300/- (non-refundable), in favor of HEC, as described here. Attach portion of payment receipt (in original) along with application form, without which your application form will NOT be accepted / processed.
6. Two attested passport size recent photographs.
7. Computerized National Identity, Card, Domicile and Pakistan Engineering Council (PEC) Certificate (mandatory)
8. Equivalence certificate from IBCC (in case of O-level and / or A-level Candidates, mandatory).
Note: Application forms, with any of the missing documents as outlined at serial number 1-8 above will be considered INCOMPLETE and will NOT be processed.
Send one complete application package in one envelope at one time. Avoid sending different requirements in different envelopes at different instances.
Closing Date for Receipt of Applications
Applications will be received up to 31-10-2007
Important Note
1. Successful applicants of Batch-I, Batch-II and Batch-III, who did not avail the offer of scholarship, will have to send fresh application, all documents, along with fee.
2. Selected applicants of Batch-IV are NOT eligible to apply against this advertisement for Batch-V of south Korea MS Scholarship Program.
3. Candidates, whose final year/semester result of BE/B.Sc (Engineering) is awaited, may also apply, but they will have to provide result (along with marks sheet) on or before 31-10-2007, Positively.
4: The Information contained on this web-page is self explanatory. Even then if you have some queries, instead of personal visits or phone calls, you are advised to communicate via e-mail ONLY. But kindly read detailed instructions uploaded on the web-page, very carefully, before sending any query.
5: Kindly avoid sending multiple envelopes containing various annexure of applications, through postal mail, or in person. You are advised to send ONE Complete application along with ALL the required documents, in one large sized envelope. Incomplete applications (with missing documents) will NOT be entertained.
How to Prepare Application Package and attach Annexures
You are advised to attach annexure, strictly in the following given order:
1. Completely filled Eligibility Assessment Form
2. Duly filled Application Form (Affix payment receipt, Copy of ID on last page, in the given space)
3. Attested copy of Matric/O Levels Certificate and Marks sheets, both (IBCC equivalency is mandatory, in case of O-level)
4. Attested copy of Intermediate/A Levels Certificate and Marks sheets both (IBCC equivalency is mandatory, in case of A-level) alongwith equivalency certificate
5. Attested copy of BE/B.Sc (Engineering) Degree accredited / recognized by PEC.
6. NTS score card (Test Held on): 12th November, 2006, 7th January, 2007, 8th April, 2007, 8th July, 2007 and 7th October, 2007. In case of more than one score, submit all results. Print Outs of Test Scores obtained from internet will not be accepted.
7. Application received after due date will not be accepted.
Where to Send Application Form?
Rezwana Siddiqui
Project Director (SK/FFSP)
HRD Division
Higher Education Commission
Sector H-9, Islamabad
Email:
southkorea-ms@hec.gov.pk
OTHER RELATED INFORMATION:
Approved Universities of South Korea
1. Reputed Universities of South Korea, name of which will be communicated to the provisionally selected applicants.
2. The provisionally selected applicants will be advised to secure admission in the selected universities, in MS Fall 2008 session (Engineering), classes starting from September, 2008 Session.
3. Normally the admission procedure for the Fall / September Session in the most of the South Korean Universities, begins from January to March.
Fields of Studies:
An indicative list of the broad fields of study offered under this Scholarship:
Electronics and Telecommunication Engineering
Robotic, Sensors and VLSI Design Technologies
Automobile Engineering including Fuel Cells and Hybrid Vehicle Technologies
New Materials and Nano Technologies
SMEs and Skill Development for SMEs
Biomedical Engineering
Environmental Engineering including Industrial Waste Management
Biotechnology
Other Engineering and Technology Fields
Note: This is not the final list of subjects as you can include any other ENGINEERING Field of your choice.
FINANCIAL DETAILS OF SCHOLARSHIP PACKAGE ARE AS UNDER:
a. Stipend: @ US $ 700, per month (to be paid for 24 months).
b. Tuition Fee: As per Universitys Requirement (maximum ceiling is US $ 8000 per year, for Two Years)
c. Other Expenditures (As per universitys requirements) including:
i. Admission / Registration Fee. (at cost, but not exceeding amount equivalent to US $ 700/-, to be paid once during two years).
ii. Study and Research Allowance. ( at cost, but not exceeding amount equivalent to US $ 400/- to be paid on yearly basis, for two years).
iii. Dissertation Allowance etc. (at cost, but not exceeding amount equivalent to US $ 50/- to be paid on yearly basis, for two years).
iv. Economy class, return air ticket, once, during the tenure of MS Engineering Program, (as per Governments provisions).
Do apply,
Very nice opportunity,
regards,
sincerely,
Noman !